Technical Program Committee



  • Firoz Ahmed, University of Rajshahi, Bangladesh
  • Sasitharan Balasubramaniam, Waterford Institute of Technology, Ireland
  • Zhisong Bie , Beijing University of Posts and Telecommunications, China
  • Arijit  Biswas, Dolby, Germany
  • Andy H P Chan, City University of Hong Kong, China
  • CCalvin C K Chan, Chinese University of Hong Kong, China
  • Kai Chen, Shanghai Jiaotong University, China
  • Nan-Kuang Chen, National United University, Taiwan
  • Wei Chen, Eindhoven University of Technology, The Netherlands
  • Xiaofei Cheng, Institute for Infocomm Research, Singapore
  • Aster Cheuk, Hong Kong Institute of Technology, China
  • Nan Chi, Fudan University, China
  • Vladimir Chigrinov, Hong Kong University of Science and Technology, China
  • Youngjoo Chong, GIST, Korea
  • Chi Wai Chow, National Chiao Tung University, Taiwan
  • Shaowei Dai, Broadband Wireless Division, RFNet Technologies Pte Ltd, Singapore
  • Sonali Dasgupta, University of Southampton, United Kingdom
  • Zhiguo  Ding, Lancaster University, United Kingdom
  • Xiaopeng Dong, Xiamen University, China
  • Xinyong Dong, China Jiliang University, China
  • Gang Feng, University of Electronic Science and Technology of China, China
  • Mable P.Fok, Priceton University, USA
  • Yandong Gong, Institute for Infocomm Research, Singapore
  • Xiang Gui, Massey University, New Zealand
  • Qi Guo, South China Normal University, China
  • Yongxin Guo, Institute for Infocomm Research, Singapore
  • Yuan Hai, Shenzhen Institutes of Advanced Technology, China
  • Jianzhong Hao, Institute for Infocomm Research, Singapore
  • Guijun  Hu, Jilin University, China
  • Weisheng Hu, Shang Hai Jiaotong University, China
  • Muhammad Khawar Islam，University of Engineering & Technology, TAXILA, Pakistan
  • Raj Jain, Washington University in Saint Louis, USA
  • Yuefeng Ji, Beijing University of Posts & Telecommunications, China
  • Tetsuya Kawanishi, National Institute of Information and Communications Technology, Japan
  • Quoc Huy Lam, Nanyang Technological University, Singapore
  • Nguyen Binh Le, Monash University, Australia
  • Bernard HL Lee, Telekom Research & Development, Malaysia
  • Gyu Myoung Lee, Institut TELECOM SudParis, France
  • Supeng Leng, University of Electronic Science and Technology of China, China
  • Changle Li, Xidian University, China
  • Jianqing Li, Macau University of Science and Technology, China
  • Xuejun Li, Nanyang Technological University, Singapore
  • Kwok Lih, Infineon Technologies, Singapore
  • Christina Lim, The University of Melbourne, Australia
  • Gong-Ru Lin, National Taiwan University, Taiwan
  • Min Liu, Chongqing University, China
  • Ning Liu, Huawei, China
  • Shiguo Liu,IBIDEN, Singapore
  • Tao Liu, Shanghai Jiao Tong University, China
  • Xiang Liu, Peking University, China
  • Yong Liu, University of Electronic Science and Technology of China, China
  • Yunqi Liu, City University of Hong Kong, China
  • Liru Lu, ST Electronics Pte Ltd, Singapore
  • Guo-Wei Lu, National Institute of Information and Communications Technology, Japan
  • Xingfang Luo, Jiangxi Normal University, China
  • Norbahiah Misran, Universiti Kebangsaan Malaysia, Malaysia
  • Jinyu Mo, Bookham Technology Co. Ltd, China
  • Dae Seung  Moon, Samsung Electronics Hainan Fiberoptics-Korea Co. Ltd., Korea
  • Shu Namiki, National Institute of Advanced Industrial Science and Technology, Japan
  • Nam T.Nguyen, Blue Moon Consulting Co., Ltd, Vietnam
  • Namkyoo Park, Seoul National University, Korea
  • Kun Qiu, Electronic University of Science and Technology of China, China
  • Tony Q.S. Quek, Massachusetts Institute of Technology, USA
  • Guobin Ren, The Central University for Nationalities, China
  • Yunfeng Shen, CIENA, USA
  • Feng Shu, IMEC, The Netherlands
  • Miroslav  Skoric, University of Novi Sad, Serbia
  • Jian Song, Research Institute of Information Technology, Tsinghua University, China
  • Lingyang Song, Philips Research, United Kingdom
  • Yikai Su, Shanghai Jiao Tong University, China
  • Qizhen Sun, Huazhong University of Science and Technology, China
  • Tong  Sun, City University London, United Kingdom
  • Jianming Tang, Bangor University, United Kingdom
  • Ming Tang, Nanyang Technological University, Singapore
  • Vrizlynn L. L. Thing, Imperial College London, United Kingdom
  • Sun Tong, City University of London, United Kingdom
  • Weijun Tong, Yangtz Optical Fiber and Cable Co. Ltd., China
  • An Tran, NICTA Ltd, Australia
  • Sandip Vijay, Indian Institutes of Technology, India
  • Li-Yang Shao, The Hong Kong Polytechnic University, China
  • Wan Shuai, Northwestern Polytechnical University, China
  • Jian Wang, Huazhong University of Science and Technology, China
  • Ling Wang, Northwestern Polytechnical University, China
  • Xinheng Wang, Swansea University, United Kingdom
  • Yong Wang, Sensilaser Technologies Inc., Canada
  • Shuangchun Wen, Hunan University, China
  • Yong H. Won, Information and Communications University, Korea
  • Elaine Wong, The University of Melbourne, Australia
  • Xiaoping Xie, Xi'an Institute of Optics and Precision Mechanics of CAS, China
  • Kun Xu, Beijing University of Posts and Communications, China
  • Shao Xu, Institute for Infocomm Research, Singapore
  • Yanling Xue, East China Normal University, China
  • Min Yan, KTH, Sweden
  • Jiang Yang, Guizhou University, China
  • Qinghai Yang , Xidian University, China
  • Zhongmin Yang, South China University of Technology, China
  • Jianping Yao, University of Ottawa, Canada
  • Rugui Yao, Northwestern Polytechnical University, China
  • Yabin Ye, Create-Net, Italy
  • Chien-Hung Yeh, Industrial Technology Research Institute, China
  • Xiaoke Yi, Sydney University, Australia
  • Jianjun Yu, Nec laboratories America, USA
  • Xia Yu, Singapore Institute of Manufacturing Technology, Singapore
  • Dongfeng Yuan, Shandong University, China
  • Yong Yuan, Corporate Technology, Siemens Ltd,China
  • A.Ping Zhang, Zhejiang University, China
  • T.I. Yuk, The University of Hong Kong, China
  • Fan Zhang, Peking University, China
  • Haixia Zhang, Munich University of Technology, Germany
  • Hanyi Zhang, TsingHua University, China
  • John Xiupu Zhang, Concordia University, Canada
  • Lin Zhang, University of Southern California, USA
  • Wenzhu Zhang, Xidian University, China
  • Xiaoguang Zhang, Institute of optical Communications and Optoelectronics, China
  • Xinliang Zhang, Huazhong University of Science and Technology, China
  • Xuping Zhang, Nanjing University, China
  • Zhenrong Zhang, Peking University, China
  • Chunliu  Zhao, The Hong Kong Polytechnic University, China
  • Jun Zhou, Ningbo University, China
  • Xiang Zhou, AT&T, USA
  • Zhiping Zhou, Peking University, China
  • Yinian Zhu, Stevens Institute of Technology,USA
  • Yongqing Zhu, Data Storage Institute, Singapore
  • Weiwen Zou, The University of Tokyo, Japan